Spring in March, spring flowers. From March 19 to 20, the management and technical elites of PCB industry gathered in Shanghai to participate in the "2019 Spring International PCB technology / Information Forum" sponsored by China Electronic Circuit Industry Association and organized by CPCA science and Technology Committee.
Over the years, the forum has provided a platform for enterprises to exchange and learn from each other, making the whole industry form a strong atmosphere of learning and research.
With the active contributions of enterprises, 116 papers from enterprises in printed circuit and related industries were collected. After careful evaluation by members of the industry expert group, 50 papers with standard writing, clear expression, novel content, practical value and representative were selected and included in the supplement (collection of papers) of this issue of printed circuit information.
On March 20, the basic forum was presided over by Wang Chengyong, vice chairman of CPCA science and Technology Committee, and Su Xinhong, member of CPCA science and Technology Committee.
There are 25 articles published and shared in the same venue. These theses are respectively from the development and production of rigid Flex PCB with flying tail structure by Shanghai jiajietong Circuit Technology Co., Ltd., a kind of electroless copper plating bath for flexible PCB by Guangdong Tiancheng Technology Co., Ltd., research on Influencing Factors of orifice hole thickness of multilayer flexible circuit board by Shenzhen Jingwang Electronics Co., Ltd., and Guangdong Shengyi Technology Co., Ltd《 Research and development of high frequency and high thermal conductivity copper clad laminate, research on fine circuit impedance production by Zhuhai Founder Technology High Density Electronic Co., Ltd., principle of nondestructive copper surface bonding technology and advantages in high frequency printed circuit board manufacturing by Shenzhen Beijia Electronic Materials Co., Ltd., application of big data in PCB process management / control, and gold plating thickness by Shantou ultrasonic PCB company Research on uniformity improvement, technical research on microstrip antenna of millimeter wave radar printed board, discussion on Influence Factors of copper front processing process on laser direct drilling by Guangdong dongshuo Technology Co., Ltd., research on PCB 2-wire and 4-wire electrical performance measurement technology by Huizhou jinbaize Circuit Technology Co., Ltd., and far infrared magnetic Co., Ltd The main contents of this paper are as follows: (1) the new chemical nickel gold process to meet the new IPC standard; (2) the research on the growth mechanism and characteristics of the tin whiskers on the chemically deposited tin plate produced by Guangzhou XINGSEN fast circuit technology Co., Ltd.; (3) the alignment analysis of different pressing processes; (3) the signal processing; (4) the research and analysis of the alignment of different pressing processes; (3) the signal processing; (4) the growth mechanism and characteristics of tin whiskers on the chemical deposited tin plate by Guangzhou XINGSEN fast circuit technology Co., Ltd Integrity case analysis and discussion, Guanghe Technology (Guangzhou) Co., Ltd., "control of server board finished products", Shennan circuit Co., Ltd. "Research on solderability of chemical tin", Shenzhen Shiqing Environmental Protection Technology Co., Ltd. "Analysis on operation effect of electrochemical nickel plating wastewater treatment by ECRM technology", and "Discussion on 5g communication antenna" by Zhuhai Jiesai Technology Co., Ltd The main influence of PCB processing process on PIM signal of printed circuit board, research on key technology of super large backplane based on key control devices for real-time acquisition and processing of high-definition audio and video signals by Shenzhen Bomin Electronics Co., Ltd., research on key technology of high-speed and high-layer circuit board by Shenzhen Chongda multilayer circuit board Co., Ltd., and ethyl vanillin-p-methylsulfonate by University of Electronic Science and technology Research on the influence of electroplating tin in acid salt system, research on the influence of parking time after copper deposition on the adhesion at the bottom of blind hole by Jiangmen Chongda Circuit Technology Co., Ltd., and analysis and improvement of ion pollution cleanliness failure in tin precipitation process by Tianjin prin circuit Co., Ltd.
At the same time, in this forum, more than ten experts formed a site scoring group, using the collective scoring method of the field expert group.
Each grading expert is very serious and rigorous to the speech paper from the innovation of the paper, the application value of the research results, whether the exposition is clear, whether the speech expression is fluent, whether the question answer is reasonable and so on, comprehensively score and announce the scoring results on the spot. This is a kind of affirmation, encouragement and encouragement to all speakers.
I believe that every scholar has learned something in the two-day forum. It is hoped that more and more enterprises will participate in it in the future, present more high-quality papers, discuss technology with each other, collide with sparks of new technology ideas, promote the development of industry technology, and show the next peak of industry technology.